Fluid Mechanics Modeling Engineer

HP is a leading global provider of products, technologies, solutions and services to consumers and business. The company's offerings span IT infrastructure, personal computing and access devices, global services, and imaging and printing. Our $4 billion annual R&D investment fuels the invention of products, solutions and new technologies so we can better serve customers and enter new markets. We invent, engineer and deliver technology solutions that drive business value, create social value and improve the lives of our customers.

Business environment

We support development of new technology and products in HP's Graphics and Imaging Business including printheads, MEMS devices, and their associated products.  Based in Corvallis, Oregon, our facility includes an IC/MEMS fab, analytical labs, and comprehensive test capability.  Success depends upon collaboration with internal partners around the world.Job description

Support development programs with expertise in fluid mechanics and heat transfer in a centralized modeling group.  A full spectrum of methods will be needed and applied as appropriate, including: quick (back-of-the-envelope) calculations, complex analytical solutions, lumped parameter and low order models, and models with detailed geometry and multiphysics.  As one in a growing team of experts in fluid mechanics and heat transfer, the person in this position will work closely with engineers in product or technology development programs to decide which methods will best provide the needed information.  In a business environment, getting results under difficult time constraints is often more important than high precision.  Inputs or material properties are sometimes not available.  Adding value under these conditions will be a key to success.  This engineer will exercise the ability to understand the technical needs of the supported programs and determine the appropriate scope of the solution. 

 

This engineer will work in three different modes:
Conducting analyses to help development programs solve specific issues.
Working as an extended member of a product or technology development team to address problems in fluid mechanics and heat transfer.
Developing and extending modeling tools and infrastructure. 

Thus, this engineer will have multiple projects ranging from hours to weeks or more in addition to responsibility for maintaining modeling infrastructure.

 

Responsibilities:
Complete fluid mechanics/heat transfer analyses of components and systems using the appropriate methods.
Partner with one or more development programs providing expertise and guidance in fluid mechanics and heat transfer.
Proactively work to reduce excessive reliance on empirical methods when time or costs can be reduced with modeling.
Communicate, reports, and archives results.
Leverage learnings between different programs.



Required skills & experience:
4 years of experience applying fluid mechanics/heat transfer skills to development programs.
Advanced degree in mechanical engineering, chemical engineering, or related field with a concentration in fluid mechanics or heat transfer.  MS required, PhD preferred.
Able to apply a deep understanding of fluid mechanics and heat transfer.  Knowledge of the theory and methods, particularly for microscale flows.
Expertise in computational methods.
Experience with model validation techniques including analysis of experimental error.
Expertise in commercial modeling software.
Presentation and communication skills.
Works well individually as well as in a team.
Able to support multiple projects simultaneously.
Understands technical limitations to business objectives.
Able to determine appropriate scope of technical problems.
Good problem solving skills.

 

Desired skills & experience:
Applying modeling methods in a commercial enterprise developing new products or technologies.
Working knowledge and experience with a general purpose CFD program. 
Experience in MEMS, low Re flows, surface flows, or phase change.
Numerical methods, algorithm development.
Grid generation techniques.
Experience in analyses with multiphysics.
Knowledge of inkjet and MEMS design and processes.Instructions

In addition to uploading your resume and cover letter, please paste both into the web form.  Your cover letter should highlight how you have applied modeling methods to accelerate development programs.  Include the types of methods and tools used and your relationship to the rest of the development team.  Indicate the scope of your work and how you communicated your results and conclusions.Company Profile

HP is a leading technology solutions provider for consumers and businesses with market leadership in fault-tolerant servers, UNIX? servers, Linux servers, Windows? servers, storage solutions, management software, imaging and printing and PCs.  Furthermore, 65,000 professionals worldwide lead our IT services team.  Our $4 billion annual R&D investment fuels the invention of products, solutions and new technologies, so that we can better serve the customers and enter new markets.  We invent, engineer and deliver technology solutions that drive business value, create social value and improve the lives of our customers.

 

HP serves more than one billion customers in more than 170 countries, with an employee base of 150,000.  At HP, we believe that diversity and inclusion are key drivers of creativity, innovation and invention. Throughout the world, we are putting our differences to work to connect everyone to the power of technology in the marketplace, workplace and community.