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SENIOR DEVELOPMENT ENG'S - ISB
| Details |
Country: USA
Location: CA San Jose
Total applied: 20
Relevant Work Experience: 5+ to 7 Years
Career Level: Experienced (Non-Manager)
Education Level: Bachelor's Degree
Job Type: Employee
Job Status: Full Time
Salary: From 100,000.00 to 130,000.00 USD per year
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SENIOR DEVELOPMENT ENG'S - ISB
Job: Senior Development Engineers
Location: San Jose, CA
Job No.: 2451783120
Industry: Semiconductor
Base salary range: $100k/yr. - $130k/yr.
A privately held, very successful semiconductor company, located in San Jose, CA needs, IMMEDIATELY, three Senior Development Engineers.
These Senior Development Engineers' education and background will include most of the following:
A minimum of a BSEE degree, with MSEE, or PhDEE preferred;
A minimum of six years of closely related, hands-on experience, with the last, min. of two years in a lead capacity;
Back end chip assembly;
Die-attach, molding, ball-attach and singulation;
Transfer molding/under-fill;
Solder ball-attach;
Flip chip and/or wire bond process/equipment/material;
Stacked die/stacked CSP;
Conducting polymers;
Conducting paste technologies;
Qualification of packaged IC's;
Paste dispense equipment;
Paste screen printing/pressure filling equipment;
Conducting ink writing/jetting/printing equipment;
Automation;
Automated die handling techniques;
Metal-filled epoxy "writing" techniques.
The hire of these engineers is being considered a TOP PRIORITY! The industry-best compensation package includes top base salary, bonus, profit sharing, outstanding fringe benefits and stock options in this exciting, privately-held company.
KEYWORDS:
- BS, MS, PhD in Electrical Engineering
- Back end chip assembly
- Die-attach, molding
- Ball-attach, singulation
- Transfer molding/under-fill
- Solder ball attach
- Flip chip and/or wire bond
- Stacked die/stacked CSP
- Conducting polymer
- Conducting paste
- Packaged IC
- Paste dispense equipment
- Paste screen printing equipment
- Pressure filling equipment
- Conducting ink writing/jeting/printing equipment
- Automation
- Automated die handling techniques
- Metal-filled epoxy "writing" techniques
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