BEOL Process/Integration

Position Description:

DESCRIPTION OF POSITION: This position is for assignment within the AMD/IBM research partnership residing at IBM's facilities in NY. Primary responsibility of this position is to conduct research, integrate and transfer (to development and to manufacturing as necessary) a multi-level copper (Cu) / ultra-low dielectric constant insulator interconnect architecture for 32nm and 22nm technology nodes for high performance microprocessor applications.

SPECIFIC JOB FUNCTIONS: Candidate should have basic working knowledge of back end of line (BEOL) unit processes, such as damascene metallization process, single and dual damascene patterning processes, low-k material deposition processes, and Cu and barrier CMP processes.

Fundamental understanding of unit process and module interactions on electrical parametric, product yield and performance criteria is a pre-requisite. Additional technical experience in BEOL reliability or test structure design is a plus. Candidate must be familiar with failure analysis and electrical parametric testing.

Candidate must also be capable of coordinating efforts and effectively collaborating with joint venture counterparts in all areas as well as with AMD's microprocessor development and circuit design groups. Candidate should also possess excellent project management, communication, and teamwork skills.

At AMD, we are committed to equal employment opportunity. AMD does not accept resumes from headhunters, placement agencies or other suppliers that have not signed a formal agreement with us. Our supplier base is restricted to specified hiring needs. Therefore, any resume received from an unapproved supplier will be considered unsolicited, and AMD will not be obligated to pay a referral or placement fee.

Qualifications:

PREFERRED EDUCATION AND EXPERIENCE: Requires a technology-related Ph.D. degree plus a minimum of 3 years of semiconductor engineering experience, preferably related to BEOL technology R&D and/or process integration.