Design Engineer, Packaging-Mechanical Design

INTERNATIONAL RECTIFIER for more than five decades has been a world leader in power management technology. IR's analog and mixed signal ICs, advanced circuit devices, integrated power systems and components enable high performance computing and eliminate energy waste from motors, the world's single largest consumer of electricity. Leading manufacturers of computers, energy efficient appliances, lighting, automobiles, satellites, aircraft and defense systems rely on IR's power management benchmarks to power their next generation products.

Design Engineer, Packaging-Mechanical Design
Automotive Systems Group

Education and Experience:
? Minimum BSME/BSMS
? 3 years minimum in the design of packaging of power electronic components/systems.
? Solid understanding of material, manufacturing and process related issues associated with complex electronic packages.
? Solid understanding of thermal transfer mechanisms and general mechanical design constraints and their relationship to package development/integration.
? Experience in the utilization of simulation software and validation experimentation to enhance the design of power semiconductor packaging.
? Must possess solid interpersonal skills and entrepreneurial approach to product developments.
? Ability to participate in a team environment and cross-functional activities working on multiple projects.
? Some familiarity with instrumentation and measurement techniques utilized in the development in power electronic devices.

Activities Summary:
The Design Engineer, Thermal-Mechanical Design will participate in, and/or lead, the new product engineering activities related to the development of automotive customer specific packaging solutions in accordance with direction established by the business development team, and according to NP-9000 (QS-9000) guidelines. This includes (but is not limited to): design validation; simulations; feedback to/from other package designers, systems engineering groups and customers with new solution designs; participation in customer interface issues related to the design; thermal/mechanical performance and simulation of new system solutions. The Design Engineer will interface with suppliers to maximize the attractiveness of the solutions provided to the customer.

Main Responsibilities:
1. Perform design engineering tasks in support of system developments using established processes (DFMEA, FEA/FEM, DFMA, boundary definition, worst case analysis, tolerance studies, etc.).
2. Execute design related activities in harmony with project schedule, new product quality system (NP-9000) and technology plan.
3. Coordinate/perform simulation for thermal/mechanical performance of the proposed solutions.
4. Validate/coordinate validation of simulations to maximize accuracy, and implements changes to the simulations.
5. Suggest cost/quality/performance improvements based on simulation/validation.
6. Interact with silicon, system and packaging engineers to ensure optimum solution is presented.
7. Participates in failure analyses, DOE, and 8D problem solving activities.

Position Characteristics:
Responsible for the package development activities and execution of actions to provide deliverables in harmony with customer requirements and direction set by the team leader. The Design Engineer is accountable to meet the target design criterion, schedules and quality goals of the project/s. The Design Engineer has the goal of finding the optimum package configuration within the timing requirements of the program that provides the thermal/mechanical requirements of the design and meets all durability requirements while maintaining acceptable cost for the final solution.

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