Director Module Business Unit

Director, Module Business Unit: a member of management and a leader of module team, a hands-on manager simultaneously working as an executive peer, a technical strategist, an architect, a development and department manager, and individual contributor. Works with internal SOC engineering and marketing to create value added SIP..

 Engineering Management Activities

 Manages the module business unit (engineering and business) on a day-to-day basis. In charge for task assignment, results analysis, and discussion, directs members of the team and gives them technical guidance. Key role in module project management during development phase.  Responsible for generating new business for  module business unit

? Monitors competitive products/industry trends/relevant technical standards

 Research and Development Activities

 Directs and performs design, process development and process engineering within the module area, including architectural and mechanical design, micromachining, new process development, new equipment evaluation, equipment purchase, existing process development, process modifications, process auditing, statistical process controls and process troubleshooting. Provides troubleshooting leadership, including using outside analytical test methods and resources. Develops problem solving methods including SPC and DOE to insure continuous process improvements. Involved in design of module Test strategy / Test plans Conducts yield enhancement and cost reduction activities

 Capabilities & Experience

 The candidate needs to have strong materials science, mechanical and electrical engineering skills with experience in package and module design / development including strong understanding of relationship between materials and package performance (experience in MEMS, multi-layer organic substrate packaging, Thick Film, screen printing a plus) Familiarity with current high volume RF/ mixed mode IC/ MEMS assembly processes (die attach, flip chip, wafer saw, wire bond, direct chip attach, surface mount, package singulation etc.)Experience in all current methods of electronics packaging to include: SIP, COB, SMT, flip chip packaging, Wafer Level Packaging & Microlaminate Products, etc. MEMS wafer level packaging, electrolytic plating, solder bumping is a plus. Experience with polymers and organics chemistry used both in binder formulations and as fugitive materials for ceramic and metal compositions is desired.  Knowledge of applications including; sensors, energy harvesting devices,  and thermal management systems Experience in failure analysis methodology required

 

 

Education/Experience:

 

? Master of Science Degree in Materials Engineering, Materials Science, Physics, or Electrical Engineering, PhD degree preferred.

?  Minimum 12 year design and management experience