Director, Sensor Application & Packaging Engineering

Job Description:  The Director, Sensor Application & Packaging Engineering, will be responsible for the design and development of sensor devices and packaging, to be integrated into the SynapSense wireless sensor networking solutions.  This individual will be responsible for developing and qualifying the sensors and packaging for current business opportunities, as well as building a development team over time.  He/she will develop sensor solutions from the die to system level.  He/she will research and evaluate available technologies and manufacturing resources to optimize solution for performance and cost effectiveness, as well as develop new product proposals for marketing including competitive analysis, risk assessment, deliverables, schedules, resources, and budgets. This individual will be the interface with Sales, Marketing, and Engineering to facilitate the new product introduction process and to develop product roadmaps and sales strategies.  The successful candidate will have experience developing novel sensing and packaging solutions for customer specific applications?such as integrating sensors into a single package, indoor/outdoor packaging and working with a wide variety of sensor types (temp, humidity, particle count, water flows, pressure, gases, etc).  He/she will have a lead role in project management efforts, including the implementation of feasibility studies, budgets, schedules & reviews.  He/she will supervise fabrication of prototypes and first builds both internally and with third party vendors.

 

Experience required:  Minimum 10 years experience in the sensor field ? ranging from design, applications and packaging.  A minimum of B.E. required, Masters preferred.

 

Location: Folsom, CA.