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 Process Engineer - Wafering

Details
Country: USA
Location: NC Durham
Total applied: 3

Relevant Work Experience: 2+ to 5 Years
Career Level: Experienced (Non-Manager)
Education Level: Bachelor's Degree
Job Type: Employee
Job Status: Full Time
Job Shift: First Shift (Day)

Process Engineer - Wafering

Department: Materials
Shift: 1st manufacturing

 

Purpose and Objectives
To provide primary sustaining engineering support for manufacturing operations in the Polish department. Optimize existing processes for the polishing and planarization of silicon carbide wafers, and develop new and efficient methods for hand-off to Operations.


Essential Job Functions
1. Process control for silicon carbide wafer polishing and planarization processes:Define process control parameters and develop monitoring systems to rapidly detect and act upon process variations.Implement rapid containment measures to minimize the effect of process deviations to customers. Investigate, resolve, and create solutions to prevent future occurrences.Review, understand, and present product and operational yields.

2. Apply good engineering practices to continuously improve silicon carbide wafer polishing and

  planarization processes:Define and refine methods to increase process repeatability and control to achieve higher yields, lower costs, higher flexibility, lower variation and a safe work environment.Initiate, manage, and participate in projects to improve wafer quality and yield to exceed customer expectations.Work with R&D team to define, qualify, and transition processes from research through development to production.

3. Define, train, qualify, and lead process changes with salaried and hourly staff to insure repeatability,

  reproducibility, and control.

4. Must be able to work several projects simultaneously and have demonstrated success in complete

  process ownership within a 24x7 manufacturing environment.


Essential knowledge and skillsBS or MS in Engineering discipline required.Experience with at least one aspect of semiconductor wafer polishing (grinding, lapping, polishing, CMP) required, with experience in multiple aspects preferred.Mechanical aptitude required, with ability to diagnose and fix problems in complex and unique equipment.Excellent MS Office skills required.Excellent overall computer and analytical skills required.Statistical process control experience required; familiarity with JMP desired.Ability to fully own a process, analyze data, and strive for continuous improvement.Strong attention to detail while effectively managing time and multiple priorities in a fast-paced manufacturing environment.High energy, self motivated attitude with strong communication skills and ability to interface effectively with coworkers of different backgrounds at every level of the company.Willing and able to work overtime when necessary. Pager call 24/7 for process issues required.

 

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