Semiconductor Process Engineer - Billerica, MA

Semiconductor Process Engineer ? Billerica, MA

NEXX Systems ? a dynamic and growing venture-backed manufacturer of semiconductor capital equipment ? is a team of dedicated innovators who continually challenge the performance of our equipment to meet the ever increasing demands of the advanced semiconductor packaging industry. Thinking outside-the-box, pushing-the envelope ? well, that?s just the beginning. If you are a creative, solutions driven person, NEXX Systems is the company for you.

Job Description: Under the direction of the Wet Process Engineering Mgr, the successful candidate will be responsible for running electroplating, stripping and etching processes and providing technical support in the fabrication of wafer scale electronic circuit and wafer bumping process.

Specific duties include: develop and implement existing, as well as new electroplating processes (Cu, Ni, SnAg etc) for advanced wafer-level packaging to meet customer's requirements and specifications; develop and conduct chemical and electrochemical processes to strip off photoresist of patterned wafer and etch away Under Bump Metallurgy (UBM) layers; optimize and determine plating tool parameters (shield size, anode structure and position, and solution agitation) to produce a high quality product; investigate electric field effect, and characterize grain size, microstructure, and properties of deposited metal and metal alloy; investigate engineering problems during plating, stripping and etching process development, test and assembly operations, and take appropriate corrective action; review product requirements and specifications, recommend and prepare changes, additions, and modifications which will optimize processes, enhance yields, reduce costs and improve performance of Stratus; analyze and control bath compositions and properties by chemical and electrochemical analytical techniques; prepare and maintain plating bath; conduct field installation and customer?s training on Stratus plating tool.

Job Requirements: Bachelor or Master of Science degree in Chemical Engineering, Material Engineering, or a related field. Class training, research or working experience on electrochemistry or electroplating process development is required.