Wafer Thinning/Dicing Technician

As a Wafer Thinning/Dicing Technician within the Assembly department at Micron, you will work in the Wafer Thinning/Wafer Dicing and Inspection area, which supports Micron with packaging solutions for wafers and die. In this position, you will be responsible for working with engineers, production personnel, and other team members to support, convert, maintain, and troubleshoot a variety of high-tech semiconductor manufacturing tools and processes. In this capacity, you will interact with manufacturing engineers to install, maintain, and optimize equipment performance, which includes collaborating with team members to maximize product quality, equipment uptime, and throughput capabilities in order to meet company goals. In this position, you will function in a cleanroom environment, which Micron operates 24 hours a day, each day of the year. Your shifts will be 12 hours long, and your work weeks will alternate between three and four days. The shifts typically run from 6 a.m. to 6 p.m. for the day shift and from 6 p.m. to 6 a.m. for the night shift, with shifts rotating between day and night every four to six months.

Successful candidates for this position will have:


A strong knowledge base in electronics, hydraulics, pneumatics, robotics, drafting, mechanical operations, and material sets.

A strong knowledge base in computer programming (preferred).

A willingness to work any shift, including weekends, nights, and holidays.

Strong verbal and written communication skills.

Strong interpersonal and organizational skills.

The ability to interact with engineering and production personnel to ensure each tool runs smoothly.

A team-oriented, self-motivated personality.

The ability to effectively contribute to Assembly production goals, both independently and as a team member.
Education:
AAS in Electronics, Mechanics, Semiconductors, or an applicable related field, or an equivalent technical or military education is required.
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