Applied Computational Physicist

APPLIED COMPUTATIONAL PHYSICIST

Rockwell Scientific (RSC) performs innovative, high-tech research to develop novel solutions for government and commercial applications of imaging technology. RSC?s mission is to provide the winning technical edge to our customers, primarily through innovation and collaboration with academia and industry. We are current seeking an exceptional Research Scientist to work closely with our technical team on an array of challenging programs in multi-scale and multidisciplinary modeling and simulation for thermal management, flow control, electronics packaging and electrochemistry applications.

Primary Responsibilities As member of a research team, you will define, develop, and deliver novel solutions to develop physics based software for the government and commercial industry though these functions: Participate in design and analysis involving thermal, fluid, electronics packaging and electrochemistry. The research activities include software development, in particular, validation of experimental results, investigation of microfludics and microscale heat transfer, and optimization of the thermal management. (50%) Develop design software based on efficient reduced model approaches to reduce the design cycle time (35%). Generate innovative ideas for thermal management and electronics packaging in collaboration with a broad team of scientists and engineers. (10%) Assist with customer interaction to demonstrate/deliver research results by written reports, briefings and participation in program reviews (5%) Due to requirements for Government contractors, this position requires US citizenship or Permanent Resident status. A small amount of travel (less than 5% time) is anticipated

Skills/ExperienceRequired qualifications: The successful candidate should have substantial experience in the software and algorithmic development for solving thermal, fluid and packaging. Strong background in PDE solvers, computational fluid dynamics, heat transfer, and solid mechanics, is required. Excellent interpersonal and communication (presentation & writing) skillsDesirable qualifications: Knowledge in electronics cooling and packaging Familiarity with parallel computing and large scale simulation Experience working with academic partners

Education PhD (or Master + 4 years working experience) in an area related to aerospace/mechanical engineering.

Relocation AssistanceYes

Security ClearanceNot required





To apply, go directly to the RSC online application form, and click on the "Apply Now" button.

EEO/AA/M/F/D/V Employer